Applied Materials, Inc. unveiled its Applied Centura Silvia Etch system, specifically designed to enable high-performance, low-cost, through-silicon via (TSV) applications. In addition to delivering a higher silicon etch rate and significantly lower operating costs than competitive systems, the Silvia system’s precise profile control enables the smooth, vertical via sidewalls that are critical for the subsequent deposition of high-quality liner and fill films. The highly flexible Silvia system c...